- reflow oven
- микр. печь для пайки методом расплавления дозированного припоя (в ИС); печь для пайки методом расплавления полуды (в печатных платах)
The New English-Russian Dictionary of Radio-electronics. F.V Lisovsky . 2005.
reflow oven
Смотреть что такое "reflow oven" в других словарях:
Reflow oven — A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards.Types of Reflow Ovens Infrared and Convection Ovens The oven contains multiple zones, which can be individually… … Wikipedia
Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… … Wikipedia
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Selective soldering — is the process of selectively soldering components to printed circuit boards, molded modules, etc. that could be damaged by the heat of a reflow oven in a traditional SMT assembly process. Consequently this process usually follows an SMT oven… … Wikipedia
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Capacitor plague — The capacitor plague (also known as bulging capacitors, bad capacitors, bad caps, popped caps, swollen caps or bloated capacitors) involved the common premature failure of certain brands of electrolytic capacitors used in various electronics… … Wikipedia
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Electronics manufacturing — This article presents a typical manufacturing process of an electronic assembly.Component manufacturingComponents such as resistors, capacitors and integrated circuits are generally made by specialized contractors. Integrated circuits are… … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Occam Process — The Occam Process is a solder free, Restriction of Hazardous Substances Directive (RoHS) compliant method for use in the manufacturing of electronic circuit boards and was developed by Verdant Electronics. It combines the usual two steps of the… … Wikipedia
